To provide a photocurable resin composition which has reduced hygroscopicity and can improve the cold-heat-cycle resistance of a cured product thereof without deteriorating the migration resistance properties thereof when the cured product is used in a printed wiring board or the like.

The photocurable resin composition comprises a carboxylic acid-containing resin, a photopolymerization initiator, an epoxidated polybutadiene compound, and a maleimide compound.