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Title:
PHOTOPOLYMERIZABLE COMPOSITION
Document Type and Number:
Japanese Patent JP2004189895
Kind Code:
A
Abstract:

To obtain photopolymerizable composition which is bondable even after photoirradiation and provides a cured material having excellent elongation and adhesive strength.

The photopolymerizable composition comprises a cationic polymerizable compound, a photocationic polymerization initiator and a monofunctional vinyl monomer. The cationic polymerizable compound is obtained by mixing an epoxy resin containing two or more glycidyl groups in the monomer with an epoxy resin containing one glycidyl group in the molecule in the ratio of 100:10-100:150. The photopolymerizable composition is obtained by mixing 100 parts wt. of the cationic polymerizable compound with 5-30 parts wt. of the monofunctional vinyl monomer and has 20-95% gel fraction immediately after photoirradiation and the gel fraction reaches 60-100% after 24 hours by heating at 20-130°C after the photoirradiation. The photopolymerizable composition is irradiated with ultraviolet light and is used as an adhesive and a tackifier.


Inventors:
MATSUDA MASANORI
Application Number:
JP2002359746A
Publication Date:
July 08, 2004
Filing Date:
December 11, 2002
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G65/10; C08G59/04; C09J4/00; C09J163/00; (IPC1-7): C08G59/04; C08G65/10; C09J4/00; C09J163/00