Title:
PHOTORESIST COMPOSITION FOR RESIST FLOW PROCESS AND METHOD FOR FORMING CONTACT HOLE USING SAME
Document Type and Number:
Japanese Patent JP2001188341
Kind Code:
A
Abstract:
To prevent the embedding of a patterns for forming a contact by overflow in an existing resist flow process.
A thermal curing agent which is cured at a specified temperature is further incorporated into a photoresist composition. The thermal curing agent contains a thermal acid generating agent which generates an acid under heat and a crosslinkable compound which is cured by heat.
Inventors:
KIN KEISHU
JUNG JAE CHANG
JUNG JAE CHANG
Application Number:
JP2000330953A
Publication Date:
July 10, 2001
Filing Date:
October 30, 2000
Export Citation:
Assignee:
HYUNDAI ELECTRONICS IND
International Classes:
G03F7/004; C08K5/42; C08L101/00; G03F7/038; G03F7/039; G03F7/40; H01L21/027; (IPC1-7): G03F7/004; C08K5/42; C08L101/00; G03F7/038; H01L21/027
Attorney, Agent or Firm:
Eiji Saegusa (8 others)