To provide a photosensitive adhesive resin composition having excellent developability and being used for producing a spacer which is arranged between a transparent substrate and a substrate on which a semiconductor element is mounted, and an adhesive film and a light-receiving device using the same.

The photosensitive adhesive resin composition contains a compound (A) having a hydroxyl group or carboxyl group and a (meth)acryloyl group; a compound (B) thermosettingly reactive with the compound (A) having a hydroxyl group or carboxyl group and a (meth)acryloyl group; a compound (C) having a (meth)acryloyl group but not having a hydroxyl group and a carboxyl group; a phenol resin or phenol (D); and a sensitizer (E).