Title:
PHOTOSENSITIVE DRY FILM RESIST, AND PRINTED WIRING BOARD AND METHOD FOR PRODUCING PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2009048170
Kind Code:
A
Abstract:
To provide a photosensitive dry film resist which can be developed with a water-based developer and excels in resolution, flame retardancy, adhesion, moisture resistance, electric reliability and handleability, a method for producing the same, and a method for applying these.
The photosensitive dry film resist comprises at least two photosensitive layers, wherein the first photosensitive layer contains a binder polymer, a (meth)acrylic compound, a photoreaction initiator, a flame retardant and a dye and/or pigment as essential components, and the second photosensitive layer contains a binder polymer and a (meth)acrylic compound as essential components and does not substantially contain a flame retardant and a dye and/or pigment.
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Inventors:
YAMANAKA TOSHIO
OKADA YOSHIFUMI
NOJIRI HITOSHI
OKADA YOSHIFUMI
NOJIRI HITOSHI
Application Number:
JP2008146023A
Publication Date:
March 05, 2009
Filing Date:
June 03, 2008
Export Citation:
Assignee:
KANEKA CORP
International Classes:
G03F7/095; C08F20/02; C08G73/10; G03F7/004; G03F7/027; G03F7/031; G03F7/033; G03F7/037; G03F7/075; G03F7/40; H05K3/28
Attorney, Agent or Firm:
Kenzo Hara International Patent Office