Title:
PHOTOSENSITIVE FILM, PRINTED WIRING BOARD PROVIDED THEREWITH, AND METHOD FOR PRODUCING THE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2004143300
Kind Code:
A
Abstract:
To provide a photosensitive film having flexibility enough to level the unevennesses of a pattern circuit and giving itself smoothness after leveling the unevennesses, to provide a printed wiring board provided with the film, and to provide a method for producing the printed wiring board.
The photosensitive film essentially comprises a base polymer and preferably contains a (meth)acrylic compound. This film has a thickness of 1-60μm, being formed so as to cover a pattern circuit having unevennesses with heights corresponding to 50-95% of the film thickness; in this case, this film levels the pattern circuit, resulting in that the level difference for unevennesses on the reverse face of the pattern circuit's leveled surface is ≤5μm.
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Inventors:
KOKAWARA KAORU
OKADA YOSHIFUMI
YAMANAKA TOSHIO
OKADA YOSHIFUMI
YAMANAKA TOSHIO
Application Number:
JP2002310059A
Publication Date:
May 20, 2004
Filing Date:
October 24, 2002
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
G03F7/004; C08J5/18; H05K3/28; (IPC1-7): C08J5/18; G03F7/004; H05K3/28
Attorney, Agent or Firm:
Kenzo Hara