Title:
PHOTOSENSITIVE PASTE AND BAKED SUBSTANCE PATTERN FORMED USING THE SAME
Document Type and Number:
Japanese Patent JP2006243108
Kind Code:
A
Abstract:
To provide a photosensitive paste which is useful to form a fine barrier rib pattern, a dielectric pattern, an electrode pattern and a black matrix pattern of a plasma display panel, suppresses thickening and gelatinization, and excel in storage stability, and to provide a baked substance pattern formed using the paste.
The photosensitive paste comprises (A) inorganic fine particles other than boric acid, (B) a carboxylic resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, (E) boric acid having a mean particle diameter (D50) of ≤20 μm and (F) a hydrophobic solvent. Preferably the paste further comprises (G) a polyhydric alcohol.
Inventors:
ITO HIDEYUKI
Application Number:
JP2005055564A
Publication Date:
September 14, 2006
Filing Date:
March 01, 2005
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/038; G03F7/004; G03F7/033; H01J11/22; H01J11/24; H01J11/34; H01J11/36; H01J11/38; H01J11/44
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