Title:
感光性ポリイミド樹脂組成物、パターン形成方法及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7247867
Kind Code:
B2
Abstract:
To provide a photosensitive polyimide resin composition capable of providing a film which enables formation of a fine pattern, and is excellent in film characteristics and reliability as a protective film with comparatively low heat treatment of substantially 200°C after pattern formation, a pattern formation method and a method for manufacturing a semiconductor device.SOLUTION: A photosensitive polyimide resin composition contains (A) primary alcoholic hydroxy group-containing polyimide that includes a repeating unit represented by the following formula (1-1) and a repeating unit represented by the following formula (1-2), and has a weight average molecular weight of 5,000-200,000, (B) polyimide which contains a phenolic hydroxy group and a weight average molecular weight of 2,000 or less, (C) a photoacid generator, and (D) a crosslinking agent. A content of the component (B) is 1-10 pts.mass based on 100 pts.mass of the component (A).SELECTED DRAWING: None
Inventors:
Yoichiro Ichioka
Kazuma Ishida
Kazuma Ishida
Application Number:
JP2019214483A
Publication Date:
March 29, 2023
Filing Date:
November 27, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
G03F7/038; C08G73/10; C08L79/08; G03F7/004; G03F7/20
Domestic Patent References:
| JP2011123278A | ||||
| JP2016030760A | ||||
| JP2009035700A | ||||
| JP2009086356A | ||||
| JP2008050401A |
Foreign References:
| KR1020080018122A |
Attorney, Agent or Firm:
Patent Attorney Corporation Eimei International Patent Office