To provide a photosensitive polymer composition capable of forming a relief pattern excellent in pattern shape by development with an aqueous alkali solution without adding a dissolution inhibitor and to provide a method for producing a relief pattern and electronic parts using the same.

The photosensitive polymer composition contains (a) a polybenzoxazole precursor soluble in an aqueous alkali solution, (b) a compound which generates an acid under light and (c) a compound having one or more tertiary alcohols having a hydroxyl group on carbon bonding directly to an aromatic ring.