Title:
感光性樹脂組成物およびこれを含むドライフィルム
Document Type and Number:
Japanese Patent JP5393806
Kind Code:
B2
Abstract:
The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.
Inventors:
He-Jun Kim
Yu Jin Kyun
Gwang-Joo Lee
Yu Jin Kyun
Gwang-Joo Lee
Application Number:
JP2011544387A
Publication Date:
January 22, 2014
Filing Date:
October 15, 2010
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
G03F7/027; C08F290/14; C08G73/10; G03F7/004; G03F7/075; H01L21/027; C07C219/34
Domestic Patent References:
| JP2003177515A | ||||
| JP63027834A | ||||
| JP5301959A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe