Title:
感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
Document Type and Number:
Japanese Patent JP7375406
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition that can give a cured film having sufficient heat resistance even when a heating temperature in a curing process is low, and that can suppress shrinkage of a film in a curing process.SOLUTION: The photosensitive resin composition comprises an epoxy resin (A1) including a biphenyl skeleton and a glycidyl oxybenzene skeleton, and is a chemically amplified type. The glycidyl oxybenzene skeleton preferably comprises a diglycidyl oxybenzene skeleton.SELECTED DRAWING: Figure 1
Inventors:
Takushi Kawanami
Yuma Tanaka
Yuma Tanaka
Application Number:
JP2019171635A
Publication Date:
November 08, 2023
Filing Date:
September 20, 2019
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/038; C08G59/20; H05K3/28
Domestic Patent References:
| JP2013018711A | ||||
| JP2015174874A | ||||
| JP2019038964A | ||||
| JP2018204010A |
Foreign References:
| WO2018194154A1 | ||||
| WO2008007762A1 | ||||
| WO2019065902A1 |
Attorney, Agent or Firm:
Shinji Hayami