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Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, BARRIER WALL, METHOD FOR FORMING BARRIER WALL AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2014041188
Kind Code:
A
Abstract:

To provide a photosensitive resin composition from which a barrier wall having excellent curability in a bottom part can be formed even when the photosensitive resin composition has light-shielding property, and to provide a photosensitive element, a barrier wall, a method for forming a barrier wall and a method for manufacturing an image display device using the above composition.

The photosensitive resin composition is used for forming a barrier wall that separates pixels in an image display device, and the photosensitive resin composition comprises: a binder polymer having a carboxyl group in the molecule as (A) component; a photopolymerizable compound as (B) component, a photopolymerization initiator as (C) component, a compound having a mercapto group as (D) component and a black pigment as (E) component.


Inventors:
SATO MAYUMI
SESATO YASUHIRO
Application Number:
JP2012182279A
Publication Date:
March 06, 2014
Filing Date:
August 21, 2012
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/004; C08G79/00
Domestic Patent References:
JP2008298859A2008-12-11
JP2008052069A2008-03-06
JP2008145790A2008-06-26
JP2007177234A2007-07-12
Foreign References:
WO2008146855A12008-12-04