Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD USING SAME
Document Type and Number:
Japanese Patent JP2004294553
Kind Code:
A
Abstract:
To provide a photosensitive resin composition which achieves all of plating durability, sensitivity, adhesion with a substrate and resolution in a high level and good balance even when the composition contains a coloring agent, and which is effective for stabilizing the quality and obtaining high resolution and high density of a printed wiring board.
The composition contains: (A) a binder polymer; (B) a photopolymerizable compound containing a compound having a tricyclodecane structure and at least one polymerizable ethylenically unsaturated bond; and (C) a photopolymerization initiator.
Inventors:
AOKI TOMOAKI
KAJIWARA TAKUYA
AJIOKA YOSHIKI
KAJIWARA TAKUYA
AJIOKA YOSHIKI
Application Number:
JP2003083705A
Publication Date:
October 21, 2004
Filing Date:
March 25, 2003
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/027; C08F291/00; G03F7/004; (IPC1-7): G03F7/027; C08F291/00; G03F7/004
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Shiro Terasaki