To provide a photosensitive resin composition excellent in photosensitivity, resolution, chemical resistance (plating resistance), close adhesion, mechanical strength and flexibility, and also provide a method of producing resist pattern.
The method of producing a resist pattern which is characterized by laminating a photosensitive element comprising a photosensitive element composition composed of (A) a binder polymer having a water absorption of 4<wt.% and a degree of dispersion of 1.0-6.0, (B) a photopolymerizable compound having at least one polimerizable ethylenically unsaturated bond having 2,2-bis(4-((meth) acryloxypolyethoxy)phenyl) propane as an essential component, and (C) a photopolymerization initiator, on a substrate for forming a circuit in a way that a photosensitive resin composition layer is adhered thereto, and carrying out exposure and development, and the method of producing a printed- wiring board characterized by etching or plating the substrate for forming the circuit in which the resist pattern is produced.
ICHIKAWA TATSUYA
OHASHI TAKESHI
HIRAI OSAMU
UENO KATSUTOSHI
UNNO AKIHIRO
| JPH0693063A | 1994-04-05 | |||
| JPS63202740A | 1988-08-22 | |||
| JPH08123018A | 1996-05-17 | |||
| JPH0990616A | 1997-04-04 | |||
| JPH1184652A | 1999-03-26 |
| WO2000052529A1 | 2000-09-08 |