Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE FILM AND PHOTOSENSITIVE PERMANENT RESIST USING SAME
Document Type and Number:
Japanese Patent JP2009109833
Kind Code:
A
Abstract:
To provide an alkali developable photosensitive resin composition capable of forming a dry film type solder resist excellent in plating resistance and resistance to the heat of soldering and also having adequate cracking resistance and HAST resistance.
The photosensitive resin composition comprises (a) a binder polymer, (b) a photopolymerizable monomer having one or more ethylenically unsaturated groups, (c) a polyurethane compound, (d) a photopolymerization initiator and (e) an inorganic filler, wherein the polyurethane compound (c) is obtained by reacting an epoxy acrylate compound having an ethylenically unsaturated group and two or more hydroxyl groups with a diisocyanate compound and a diol compound having a carboxyl group.
Inventors:
OTOMO SATOSHI
OHASHI TAKESHI
YOSHIDA TETSUYA
FUJII TETSUFUMI
OHASHI TAKESHI
YOSHIDA TETSUYA
FUJII TETSUFUMI
Application Number:
JP2007283262A
Publication Date:
May 21, 2009
Filing Date:
October 31, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/027; G03F7/004; G03F7/033; H05K3/28