To provide a photosensitive resin composition having excellent resolution for a fine pattern, excellent heat resistance, chemical resistance, water resistance, solvent resistance, resistance against gold plating, and electric insulating property, and being suitable as an alkali developing type photo solder resist, and further provide a photosensitive film using the composition.
The photosensitive resin composition contains: an alkali-soluble resin (A) prepared by the reaction of an alkali-soluble polymer (a1) having a phenolic hydroxyl group and 300 to 30,000 weight average molecular weight and a compound (a2) having a polymerizable double bond and an isocyanate group, with the equivalent ratio of the isocyanate group in the compound (a2) to the hydroxyl group in the polymer (a1) ranging from 0.1 to 0.8; a phenol filler (B); a photopolymerizable monomer (C); and a compound (D) having an epoxy group but no photopolymerizable property. The invention also provides the photosensitive film having a layer comprising the above photosensitive resin composition on a supporting body, and a method for manufacturing the photosensitive film.
SHIMADA KENSHIROU
TSURUTA HIROAKI
ISHIKAWA TAKASHI
MIURA YASUO
ITO NOBUO
AJINOMOTO KK
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