To provide a photosensitive resin compsn. having improved adhesion to a base metal, less liable to undercutting by etching and useful for the precision working of a metal and to obtain a photosensitive film using the compsn.

This photosensitive resin compsn. contains a polymer binder (A) contg. (meth)acrylic acid, an alkyl (meth)acrylate and a (meth)acrylate having an amino group as constituent monomers, a monomer (B) having at least one polymerizable ethylenically unsatd. bond in one molecule and a photopolymn. initiator (C) represented by formula I or II as essential components. In the formula I, X is halogen and R is aryl or substd. aryl. In the formula II, each of R1-R4 is alkyl, amino, alkylamino, hydroxyl, aryl, halogen, benzyl or morpholino.