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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FOR FORMATION OF OPTICAL WAVEGUIDE, FILM FOR FORMATION OF OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE, OPTICAL INTERCONNECTION, OPTO-ELECTRIC HYBRID BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2011017931
Kind Code:
A
Abstract:

To provide: a photosensitive resin composition that exhibits low optical propagation loss and excelling thermal properties, to provide a photosensitive resin composition for formation of an optical waveguide, which also exhibits low optical propagation loss and excelling thermal properties by using the photosensitive resin composition, and to provide a film for formation of an optical waveguide, the optical waveguide, an optical interconnection, an opto-electrical hybrid board, and electronic device.

The optical waveguide can be obtained, by forming the film for formation of the optical waveguide by using the photosensitive resin composition comprising, in a portion of its side chain; a polymer including a vinylether group and a maleimide group; and crosslinking the vinylether group and the maleimide group by radiating the light to the film. The optical waveguide has a core section and a clad section, each having refractive index that differs.


Inventors:
MORI TETSUYA
Application Number:
JP2009162904A
Publication Date:
January 27, 2011
Filing Date:
July 09, 2009
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G02B6/12; C08F32/02
Domestic Patent References:
JP2008233362A2008-10-02
JP2010519340A2010-06-03
JP2004285249A2004-10-14
JP2006323244A2006-11-30