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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING OPTICAL WAVE GUIDE PATH, FILM FOR FORMING OPTICAL WAVE GUIDE PATH, OPTICAL WAVE GUIDE PATH, OPTICAL WIRING, PHOTOELECTRICITY MIXTURE-LOADED SUBSTRATE AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2011105791
Kind Code:
A
Abstract:

To provide a photosensitive resin composition simultaneously having developability, low loss and heat resistance; to provide a photosensitive resin composition for forming optical wave guide paths; to provide a film for forming optical wave guide paths; to provide an optical wave guide path; to provide an optical wiring: to provide a photoelectricity mixture-loaded substrate; and to provide an electronic equipment.

The photosensitive resin composition comprising a cyclic olefinic copolymer having repeating units represented by following formula (1) is characterized in that the weight-average mol.wt. of the cyclic olefinic copolymer is 30,000 to 200,000 and X in the cyclic olefinic copolymer is 20 to 50 mol%, when the molar fraction of the repeating unit represented by formula (1) is X. The photosensitive resin composition for forming the optical wave guide paths, the film for forming optical wave guide paths, the optical wave guide path, the optical wiring, the photoelectricity mixture-loaded substrate, and the electronic equipment use each the photosensitive resin composition.


Inventors:
SAKAMOTO MARIKO
TAKAHAMA KEIZO
MORI TETSUYA
Application Number:
JP2009259295A
Publication Date:
June 02, 2011
Filing Date:
November 12, 2009
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F232/04; G02B6/12
Domestic Patent References:
JP2006330117A2006-12-07
JP2010519340A2010-06-03
JP2008233362A2008-10-02
Foreign References:
WO2008070774A12008-06-12
US20040082724A12004-04-29