Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN HARDENED FILM, AND METHOD FOR FORMING LIGHT-SHIELDING IMAGE
Document Type and Number:
Japanese Patent JP2009222791
Kind Code:
A
Abstract:
To provide a photosensitive composition with which a black matrix having excellent pattern precision and hardness is obtained by using nanoimprint lithography.
The photosensitive resin composition is a composition which contains at least a coloring agent and a polymerizable monomer, includes a binder at no more than 10 mass% based on the total solids, and has viscosity of 3 to 50 mPa s in a state containing essentially no solvent after drying, and which is characterized in that the optical density of the hardened film, having thickness of 1 m, of the hardened composition is 3.5 or more.
Inventors:
SATO MORIMASA
Application Number:
JP2008064535A
Publication Date:
October 01, 2009
Filing Date:
March 13, 2008
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G02B5/20; C08F2/44; C08F20/10; G02B5/00; G02F1/1335
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes