Title:
インクジェット用感光性樹脂組成物およびプリント配線基板
Document Type and Number:
Japanese Patent JP7218387
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition that can form a cured product having excellent coatability in an inkjet method, and excellent electrical insulation properties, fire retardancy and bleed resistance.SOLUTION: A photosensitive resin composition for inkjet of the present invention including: (meth)acrylic resin (A) having the weight-average molecular weight of 500 or more; (B) (meth)acrylic compound having the weight-average molecular weight of less than 500; (C) phosphorus-containing compound; and (D) photopolymerization initiator, in which the component (C) is a compound other than phosphate ester, which is a compound having a functional group reactable by photo-radical polymerization or photo-cationic polymerization.SELECTED DRAWING: None
Inventors:
Yoshio Okamoto
Eisai Hiroshi
Eisai Hiroshi
Application Number:
JP2021021068A
Publication Date:
February 06, 2023
Filing Date:
February 12, 2021
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
C09D11/30; C08F2/50; C09D11/101; H05K3/28
Domestic Patent References:
| JP2013189532A | ||||
| JP2014141568A | ||||
| JP2008222677A | ||||
| JP2010143982A | ||||
| JP2010229220A | ||||
| JP2015110765A | ||||
| JP2017149811A |
Foreign References:
| US20070149635 | ||||
| CN108976899A | ||||
| WO2018124205A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Kinoshita Intellectual Property Office
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