Title:
PHOTOSENSITIVE RESIN COMPOSITION, INSULATION FILM AND IMAGE DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2017181691
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which an insulation film exhibiting a sufficiently low relative permittivity can be formed without subjecting the film to a high-temperature heat treatment.SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photocurable monomer, (C) a photopolymerization initiator and (D) a solvent, and further contains (A) polysaccharides by 15 mass% or more in the total solid content.SELECTED DRAWING: None
Inventors:
YAMAKAWA TOMOKO
SAWAI YOSHIHISA
SAWAI YOSHIHISA
Application Number:
JP2016066779A
Publication Date:
October 05, 2017
Filing Date:
March 29, 2016
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
G03F7/004; G02F1/1333; G03F7/027; H01L51/50; H05B33/22