Title:
感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
Document Type and Number:
Japanese Patent JP5567290
Kind Code:
B2
Abstract:
Disclosed is an alkali-developable photosensitive resin composition which comprises (A) a resin produced using a recovered polyester as a raw material and (B) a photopolymerization initiator. Preferably, the resin (A) is a polyol, a carboxyl-group-containing resin, or a photosensitive resin having an ethylenically unsaturated group, particularly a polyol produced by depolymerizing a recovered polyester (a) with two or more molecules of a polyol (b) per molecule of the polyester (a), a carboxyl-group-containing resin produced by reacting the recovered polyester (a) with a polybasic acid or an anhydride thereof (c) prior to, simultaneously with or subsequent to the depolymerization, or the like. Preferably, the photosensitive resin composition additionally comprises a carboxyl-group-containing photosensitive resin (C) that is different from the resin (A). Preferably, the photosensitive resin composition additionally comprises a heat-curable component (D), or additionally comprises a coloring agent (E). The photosensitive resin composition or a dry film thereof is advantageously applicable to the formation of a cured coating film such as a solder resist for a printed wiring board or a flexible printed wiring board, or the like.
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Inventors:
Daichi Okamoto
Seio Arima
Seio Arima
Application Number:
JP2009115458A
Publication Date:
August 06, 2014
Filing Date:
May 12, 2009
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
G03F7/027; C08F2/44; C08F20/20; C08F299/00; C08J11/24; G03F7/004; G03F7/032; H05K3/28; C08G18/67
Domestic Patent References:
| JP2004307583A | ||||
| JP2006233148A | ||||
| JP2006249441A | ||||
| JP2005331932A | ||||
| JP2001131251A |
Attorney, Agent or Firm:
Ichiro Honda