To provide a negative photosensitive polyimide precursor which can be exposed to UV rays, in particular, to the i-line (at 365 nm) and which has high Tg, low α and low dielectric constant, and to provide its manufacturing method.

The photosensitive resin composition comprises: (A) a polyimide precursor expressed by general formula (1); (B) a dehydrating condensing agent for manufacturing a polyimide precursor; (C) a photosensitive agent to improve sensitivity to active rays; and (D) a solvent. In formula (1), each of R1 and R2 represents a tetravalent aromatic group or a tetravalent organic group having a plurality of aromatic rings coupled with a single bond, -O-, or the like, R3 represents a divalent aromatic group or a divalent aromatic group having a plurality of aromatic rings coupled with a single bond, -O- or the like, each of R4 and R5 represents a divalent aromatic group or a divalent aromatic group having a plurality of aromatic rings coupled with a single bond, -O-, or the like, each of R6, R7, R8 and R9 represents a monovalent organic group having one or more ethylenically unsaturated bonds, and each of m and n represents an integer of ≥1.