To provide a photosensitive resin composition superior in sensitivity and photocurability, capable of forming a pattern in high precision by photolithography and superior in folding resistance, solder resistance, flame-retardancy and coating operability on a film, and to provide a photosensitive laminate using this composition.
This photosensitive composition and the photosensitive laminate having a layer of this composition comprise (A) an acid-anhydride-modofied polyamide resin obtained by allowing an epoxy resin and a monocarboxylic acid to react with the reaction product of apolycarboxic acid containing a polycarbonatediol-modified dicarboxylic acid and a diisocyanate, and allowing the obtained epoxy-blocked type polyamide to react with a cyclic polycarboxylic acid monoanhydride and an unsaturated isocyanate monomer, (B) a photopolymerizable unsaturated compound having at least one ethylenically unsaturated group on the terminal, and (C) a photopolymerazation initiator.
OTA FUMIHIKO
SUZUKI KENJI
NISHIZAWA HIROSHI
