To provide a photosensitive resin composition capable of achieving satisfactory compatibility when forming a dry film and excellent resolution and close adhesiveness, showing equal sensitivity when exposed to light of exposure machines of both types of i-line and h-line, and developing by an alkaline aqueous solution.
This photosensitive resin composition contains (a) a thermoplastic copolymer of 20-90 wt.% containing α,β-unsaturated carboxyl group containing monomer of 100-600 by acid equivalent as a copolymer component and having an average molecular weight of 5,000-500,000, (b) an addition polymerizable monomer of 5-75 wt.% having at least one terminal ethylenic unsaturated group, (c) a photopolymerization initiator of 0.01-30 wt.% containing triarylimidazolyl dimer, and (d) a specific pyrazoline compound of 0.001-10 wt.%. The addition polymerizable monomer having at least one terminal ethylenic unsaturated group expressed in (b) contains the specific compound.
COPYRIGHT: (C)2010,JPO&INPIT
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Hideo Takei
Yoshiaki Matsui