To provide a photosensitive resin composition easy in its manufacturing method and especially, excellent in storage stability by incorporating a specified ammonium salt and a specified polyimide precursor.

This photosensitive resin composition contains the ammonium salt represented by the formula (a) R4N+A- and (b) the polyimide precursor, and in the formula, each of R4 is, independently, a hydrocarbon group, and A- is an acid anion for forming an ionic bond with R4N+ and it is an acid anion of a nitric or picric or carboxylic or sulfonic acid, and the ammonium compound (a) is obtained by neutralizing an aqueous acid solution shown by H-A with R4NOH and then, removing water. The photosensitive polyimide precursor is obtained by forming an amide bond of tetracarboxylic acid anhydride or its derivative with diamine. The (a) component is used in an amount of 0.01-10 pts.wt. to 100 pts.wt. of the (b) component.