Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
感光性樹脂組成物、レジストパターンの形成方法、メッキ造形物の製造方法、および半導体装置
Document Type and Number:
Japanese Patent JP7347430
Kind Code:
B2
Abstract:
The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3) and a photoacid generator (B). In the formulae (a1) to (a3), R11, R21, and R31 each independently represent a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atom or a halogen atom; R12 and R32 each independently represent a divalent organic group; R22 represents a substituted or non-substituted alkanediyl group having 2 to 10 carbon atoms; R13 represents an acid dissociable group having an alicyclic structure; R23 represents an alkyl group having 1 to 10 carbon atoms; R33 represents a hydroxyaryl group; and 1, m and n each independently represent an integer from 0 to 10.

Inventors:
Taniguchi Takuhiro
Naoki Nishiguchi
Tomoyuki Matsumoto
Hirokazu Sakakibara
Akito Hiro
Naonori Akimaru
Application Number:
JP2020538217A
Publication Date:
September 20, 2023
Filing Date:
July 01, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JSR CORPORATION
International Classes:
G03F7/039; C08F220/28; C08F220/30; G03F7/20
Domestic Patent References:
JP2013137524A
JP2018115158A
JP2012185281A
JP2017107140A
JP2008058710A
JP2011095662A
JP2015041098A
Foreign References:
WO2018012472A1
Attorney, Agent or Firm:
Patent Attorney Corporation SS International Patent Office
Kiyomichi Kojima
Yasuyuki Hiraiwa