To provide a photosensitive resin composition hardly causing appearance defects.

The photosensitive resin composition contains (a) a polyimide resin or its precursor, (b) a quinone diazide compound, (c) a solvent and (d) a surfactant, wherein the surfactant (d) contains (d1) a silicon-based surfactant and (d2) a surfactant containing a fluorine atom, the contents X mass% and Y mass% of (d1) and (d2), respectively, in the photosensitive resin composition satisfy X>Y (Y≠0), and the whole amount of the surfactant (d) lies in a range of ≥0.005 mass% and ≤0.10 mass% in the photosensitive resin composition.