Title:
PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING COPOLYMER
Document Type and Number:
Japanese Patent JP2018173474
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of obtaining a pattern which has good sensitivity or developability and is excellent in resistance to thermal decomposition and resistance to thermal yellow discoloration.SOLUTION: A photosensitive resin composition contains a copolymer having a structural unit derived from an ethylenically unsaturated group-containing carboxylic acid metal salt, a structural unit derived from an ethylenically unsaturated group-containing carboxylic acid and a structural unit derived from other radical polymerizable monomers other than the ethylenically unsaturated group-containing carboxylic acid metal salt and the ethylenically unsaturated group-containing carboxylic acid, a solvent, a reactive diluent, and a photopolymerization initiator.SELECTED DRAWING: None
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Inventors:
KINOSHITA TAKEHIRO
OGAWA KOSHI
YANAGI MASAYOSHI
OGAWA KOSHI
YANAGI MASAYOSHI
Application Number:
JP2017070283A
Publication Date:
November 08, 2018
Filing Date:
March 31, 2017
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
G03F7/033; C08F2/44; C08F2/48; C08F246/00; G03F7/027
Attorney, Agent or Firm:
Michiharu Soga
Kajinami order
Kazuhiro Oyaku
Kajinami order
Kazuhiro Oyaku