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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, PATTERN MANUFACTURING METHOD USING THE COMPOSITION, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2009086356
Kind Code:
A
Abstract:

To provide a composition of excellent film property reducing coloring and the change of film strength with the lapse of time, and a highly reliable electronic device having a pattern with excellent shape and a characteristic.

The present invention relates to the photosensitive resin composition containing (a) a polyimide resin having a specified repetition unit, (b) a compound generating a sulfonic acid when irradiated with light, and (c) a crosslinking agent having an alkoxymethyl or acyloxymethyl group on a nitrogen atom, a pattern manufacturing method using the composition, and the electronic device having the pattern.


Inventors:
WATANABE YASUSHI
SATO KENICHIRO
Application Number:
JP2007256783A
Publication Date:
April 23, 2009
Filing Date:
September 28, 2007
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08G73/10; G03F7/004; G03F7/023; H01L21/027
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa