To provide a photosensitive resin composition forming a matte cured film which produces a satisfactory flatting effect to prevent sticking of solder and is excellent also in electric corrosion resistance, gold plating resistance and adhesion to a substrate without using a flatting agent.

The photosensitive resin composition comprises (A) a photosensitive resin obtained by reacting a component (a) comprising an epoxy-containing polymer (a-1) obtained by polymerizing a monomer component (i) comprising an ethylenically unsaturated monomer (i-1) having an epoxy group with an ethylenically unsaturated monomer (b) having a carboxyl group and with a polybasic acid anhydride (c) in order, (b) an epoxy compound having two or more epoxy groups per molecule, (C) a photopolymerization initiator, (D) a diluent and (E) an ethylenically unsaturated group-containing resin obtained by reacting a product (e) obtained by polymerizing a component (ii) comprising an ethylenically unsaturated monomer (ii-1) having a carboxyl group with an ethylenically unsaturated monomer (f) having an epoxy group.