To provide a photosensitive resin composition excellent in resolution and thin line adhesiveness to an ITO film, an SnO2 film and a metal substrate such as an Al substrate, excellent also in etching resistance, and effective in electrode formation of a plasma display panel, and to provide a photoresist film using the same.

The photosensitive resin composition contains a binder polymer (A), a carboxyl-containing urethane (meth)acrylate resin (B), an ethylenically unsaturated compound (C), a phosphoric ester compound (D) and a photopolymerization initiator (E). The photoresist film uses the same.