Title:
感光性樹脂組成物、ポリアミド樹脂、ポリアミド樹脂の製造方法、化合物、化合物の製造方法、硬化膜の製造方法、及び硬化膜
Document Type and Number:
Japanese Patent JP6909093
Kind Code:
B2
Abstract:
A photosensitive resin composition capable of forming a cured film with satisfactory adhesion to substrates and excellent transparency, a polyamide resin which is used in the photosensitive resin composition, a method for producing the polyamide resin, a compound which is used as a raw material of the polyamide resin, a method for producing the compound, a method for producing a cured film using the photosensitive resin composition, and a cured film which is obtained by curing the photosensitive resin composition. The photosensitive resin composition including a resin and a photopolymerization initiator. The resin is a polyamide resin including a structural unit, which includes a specific saturated alicyclic skeleton, and at least one carboxy group esterified by a unit containing a polymerizable group of a predetermined structure.
Inventors:
Keisuke Tadokoro
Shioda Dai
Shioda Dai
Application Number:
JP2017151972A
Publication Date:
July 28, 2021
Filing Date:
August 04, 2017
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/027; C08G73/10
Domestic Patent References:
| JP6522130B2 | ||||
| JP2014237820A | ||||
| JP2011162479A |
Foreign References:
| WO2017126409A1 | ||||
| WO2013168675A1 | ||||
| WO2014034760A1 | ||||
| US20150086753 | ||||
| US20160018733 | ||||
| CN103897185A |
Attorney, Agent or Firm:
Masayuki Masabayashi