Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2004138752
Kind Code:
A
Abstract:
To provide a photosensitive resin composition for a solder resist, which has high adhesiveness, excellent acid resistance and plating resistance and good in other coating film performances, and to provide a printed wiring board using the composition.
The photosensitive resin composition comprises: (A) an active energy ray curing resin having at least two ethylenically unsaturated bonds in one molecule; (B) a polybutadiene-based polymer compound; (C) a photopolymerization initiator; (D) a diluent; and (E) a thermosetting compound.
Inventors:
HASEGAWA YASUYUKI
TEJIMA TORU
ITO MASARU
ONO TAKAO
TEJIMA TORU
ITO MASARU
ONO TAKAO
Application Number:
JP2002302409A
Publication Date:
May 13, 2004
Filing Date:
October 17, 2002
Export Citation:
Assignee:
TAMURA KAKEN CO LTD
International Classes:
C08F299/00; G03F7/027; G03F7/038; H05K3/28; G03F7/033; (IPC1-7): G03F7/033; C08F299/00; G03F7/027; G03F7/038; H05K3/28
Attorney, Agent or Firm:
Tadashi Sano
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