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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND SOLDER RESIST USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2007003807
Kind Code:
A
Abstract:

To provide a photosensitive resin composition having proper dispersibility of pigments, and a solder resist, having neither pigment aggregate nor uneveness color tone and ensuring proper pattern accuracy.

The photosensitive resin composition contains an ultraviolet-curing resin, a light-absorbing agent and a green pigment mixture, wherein the green pigment mixture contains a yellow pigment and/or an orange pigment, a blue pigment and an organic solvent, wherein each of the yellow, orange and blue pigments comprises a halogen-free compound. The total amount of the yellow and orange pigments contained in the green pigment mixture (C) and the amount of the blue pigment are preferably in the weight ratio 1:10 to 10:1. It is preferable that the green pigment mixture (C) further contain white pigment.


Inventors:
HIROSE HIROSHI
Application Number:
JP2005183615A
Publication Date:
January 11, 2007
Filing Date:
June 23, 2005
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/004; H05K3/00
Domestic Patent References:
JP2003114524A2003-04-18
JP2005157311A2005-06-16
JP2001142201A2001-05-25
JP2000232264A2000-08-22
Foreign References:
WO2001067178A12001-09-13