To provide a photosensitive resin composition free of safety problem to a living body, having good suitability to application even to a large substrate, capable of faithfully reproducing the design size of a mask pattern with high sensitivity, and capable of forming spacers for a display panel excellent in adhesion to the substrate and excellent also in strength, heat resistance, etc.

The photosensitive resin composition comprises (A) a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride, (a2) an epoxy-containing ethylenically unsaturated compound and (a3) another ethylenically unsaturated compound, (B) a polymerizable compound having an ethylenically unsaturated bond, (C) a radiation sensitive polymerization initiator, and (D) an organic solvent typified by 1-(1-methyl-2-methoxyethoxy)-2-methoxypropane.