Title:
感光性樹脂組成物、構造体、電子デバイス、および、その製造方法
Document Type and Number:
Japanese Patent JP7218506
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition that has excellent adhesion to inorganic material, and has excellent bonding strength, and a structure and an electronic device including a cured film of the photosensitive resin composition, and a method of producing the same.SOLUTION: A photosensitive resin composition for film formation has a polymer containing a structural unit derived from a cyclic olefin in the molecule, a photosensitizer, and a silane coupling agent having an acid anhydride group in the molecule.SELECTED DRAWING: Figure 1
Inventors:
Yuma Tanaka
Application Number:
JP2018096115A
Publication Date:
February 07, 2023
Filing Date:
May 18, 2018
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
G03F7/023; C08F32/00; G03F7/075; G03F7/20
Domestic Patent References:
| JP2004010697A |
Attorney, Agent or Firm:
Shinji Hayami
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