To provide a photosensitive resin composition which is free from halogen compound in its compounds and exhibits good fire resistance and has anti-insulation reliability (anti-migration resistance), adhesion property, heat resistance, flexing resistance and solvent resistance, a photosensitive film using the photosensitive resin composition and a laminate.

The photosensitive resin composition includes polyimide resin precursor, a photosensitive agent and at least one phosphazene compound selected from a group of straight-chain phenoxyphosphazene compounds and cyclic phenoxyphosphazene compounds.