Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2012159601
Kind Code:
A
Abstract:
To provide a photosensitive resin composition which has excellent sensitivity and has small in-plane variation of a resolution dimension.
The photosensitive resin composition contains: (a) an alkali-soluble resin selected from polyimide, a polyimide precursor and polyhydroxy amide which is a polybenzoxazole precursor, or a copolymer of the components; (b) a radiation-sensitive compound; (c) a nonionic surface active agent with an HLB value in a range of 5.0-9.5; and (d) a solvent.
Inventors:
KAMEMOTO SATOSHI
ISOBE MIKIO
TOMIKAWA MASAO
ISOBE MIKIO
TOMIKAWA MASAO
Application Number:
JP2011018075A
Publication Date:
August 23, 2012
Filing Date:
January 31, 2011
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
G03F7/004; G03F7/023; G03F7/037; H01L21/027