PHOTOSENSITIVE RESIN COMPOSITION

Title:

PHOTOSENSITIVE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2021103299

Kind Code:

A

Abstract:

To provide a photosensitive resin composition having excellent insulation reliability.SOLUTION: A photosensitive resin composition contains (A) a photo-base generator having a compound represented by formula (1) (where, at least one of R4 is an organic group having a thioether bond and the other is an organic group having a hydrogen atom or a thioether bond, and A is substituent represented by the formula (1-1) or (1-2)), (B) an alkali-developable resin, (C) a heat-reactive compound and (D) a photopolymerizable monomer.SELECTED DRAWING: None

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Inventors:

TERADA KIWAMU
TSUBAMOTO MAI
MIZUGUCHI TAKAFUMI

Application Number:

JP2020212203A

Publication Date:

July 15, 2021

Filing Date:

December 22, 2020

Export Citation:

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Assignee:

NIPPON KAYAKU KK

International Classes:

G03F7/004; C08F2/44; C08F265/02; C08F283/00; C08F283/06; C08F283/10; G03F7/038; H05K1/03; H05K3/28

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