Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2022057777
Kind Code:
A
Abstract:
To provide a photosensitive resin composition or the like excellent in lamination properties.SOLUTION: The photosensitive resin composition contains (A) an alkali-soluble resin having a phenolic hydroxyl group in the molecule, (B) a compound containing at least two or more alkoxymethyl groups in the molecule, (C) a photoacid generator, and (D) a solvent. The component (A) contains (A-1) a bifunctional phenol compound. The component (D) contains (D-1) a solvent containing a hydroxyl group. The content of the component (D-1) is 5 mass% or more and 95 mass% or less based on 100 mass% of the whole component (D).SELECTED DRAWING: None
Inventors:
KASUMI KENICHI
Application Number:
JP2020166202A
Publication Date:
April 11, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
G03F7/038; C08G14/04; G03F7/004
Attorney, Agent or Firm:
Sakai International Patent Office