Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023127745
Kind Code:
A
Abstract:
To provide a photosensitive resin composition that yields a cured film with a low dielectric loss tangent, exhibits high storage stability, shortens development time in organic solvent development even when containing polyimide, and allows for low residual stress.SOLUTION: A photosensitive resin composition contains polyimide and a solvent. The polyimide includes a divalent aromatic group with a photopolymerizable moiety and a C14-28 divalent aliphatic hydrocarbon group without alicyclic structures.SELECTED DRAWING: None
Inventors:
ISHII HIDENORI
ENDO TAKAFUMI
SAKAGUCHI TAKAHIRO
OGINO HIROSHI
HOSHINO YUKI
ENDO TAKAFUMI
SAKAGUCHI TAKAHIRO
OGINO HIROSHI
HOSHINO YUKI
Application Number:
JP2022031619A
Publication Date:
September 14, 2023
Filing Date:
March 02, 2022
Export Citation:
Assignee:
NISSAN CHEMICAL CORP
International Classes:
G03F7/027; C08G73/10; G03F7/004; G03F7/20
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Takeshi Yamashita
Sachiko Komori
Nao Oda
Takeshi Yamashita
Sachiko Komori