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Title:
PHOTOSENSITIVE RESIN LAMINATE
Document Type and Number:
Japanese Patent JPH04129732
Kind Code:
A
Abstract:

PURPOSE: To prevent the generation of static electricity and to prevent the inferiority such as the disconnection or breakage of the circuit of a printed wiring board by using a transparent conductive film as a support film.

CONSTITUTION: A support film 1 composed of a transparent conductive film is formed by laminating a transparent conductive film composed of ITO to the single surface of a polymer film 2 having flexibility such as a polyethylene terephthate film or a polyethylene naphthalate film. A photosensitive resin layer is laminated to the surface opposite to the transparent conductive film 3 of the support film 1. This support film 1 is prevented from static electrification by the transparent conductive film 3 and, therefore, when the support film 1 is drawn out of a taking-up roller in work laminating a dry film 5 to an insulating substrate, the support film generates no static electricity and is prevented from the adhesion of dust.


Inventors:
ITAYAMA HIDEKATSU
YOKOYAMA HIROYOSHI
NOGUCHI KOICHI
Application Number:
JP25338190A
Publication Date:
April 30, 1992
Filing Date:
September 21, 1990
Export Citation:
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Assignee:
HITACHI AIC INC
International Classes:
G03F7/004; B32B7/02; B32B27/18; G03F7/09; H05K3/06; (IPC1-7): B32B7/02; B32B27/18; G03F7/004; G03F7/09; H05K3/06