PHOTOSENSITIVE SILICONE RESIN COMPOSITION - ASAHI KASEI E MATERIALS CORP

Title:

PHOTOSENSITIVE SILICONE RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2013163785

Kind Code:

A

Abstract:

To provide a resin composition providing a photosensitive resin composition having good crack resistance when molded in a thick film, being excellent in light resistance, and having good transparency even after a reflow step.

A photosensitive silicone resin composition contains 100 parts by mass of a silica particle-containing condensation reaction product (A) which is a condensation reaction product of one or both of a specific silane compound (a1) and a polysiloxane compound (a2) which is a hydrolysis condensation product of the silane compound (a1), with a silica particle (b), and 0.01 to 50 pts.mass of a photopolymerization initiator (B), wherein the content of a nitrogen atom is ≤300 mass-ppm, and the silica particle-containing condensation reaction product (A) has a photopolymerizable functional group.

Inventors:

KUSAKABE TORU
TSUGANE NATSUMI
SAITO HIDEO

Application Number:

JP2012028720A

Publication Date:

August 22, 2013

Filing Date:

February 13, 2012

Export Citation:

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Assignee:

ASAHI KASEI E MATERIALS CORP

International Classes:

C08L83/04; C08F290/06; C08F290/14; C08F299/08; C08G59/20; C08G75/04; C08G75/045; C08G77/20

Domestic Patent References:

JP5555323B2	2014-07-23
JP2000103987A	2000-04-11
JP2003196883A	2003-07-11
JPH09194760A	1997-07-29
JP2009046526A	2009-03-05
JPS57500984A	1982-06-03
JPH08311115A	1996-11-26
JP2009155138A	2009-07-16
JP5597060B2	2014-10-01

Foreign References:

WO2010001875A1

2010-01-07

Attorney, Agent or Firm:

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima

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