Title:
METHOD OF MEASURING PHYSICAL PROPERTIES, METHOD OF EVALUATING MEMBER, METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING MATERIAL FOR ELECTRONIC COMPONENT DEVICE, AND PHYSICAL PROPERTY MEASUREMENT SYSTEM
Document Type and Number:
Japanese Patent JP2023094616
Kind Code:
A
Abstract:
To provide a method of measuring physical properties, a physical property measurement system, a method of evaluating a member including the method, a method of manufacturing an electronic component device and a method of manufacturing a material for electronic component device which can evaluate the relation between the deformation rate and the water absorption rate of a member regardless of the correlation between heat deformation and the water absorption rate for the member including an organic material.SOLUTION: A method of measuring physical properties includes: a preparation step of preparing a moistened member containing an organic material and having a known water absorption rate and a known mass; a heating and cooling step of performing cooling after heating the member; and a measurement step of measuring a mass of the member after cooling the member in the heating and cooling step, in which in the heating and cooling step, a deformation rate of the member is measured using a digital image correlation method.SELECTED DRAWING: None
Inventors:
NOMAN YUICHI
Application Number:
JP2022207294A
Publication Date:
July 05, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
G01N25/16; G01N5/04
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office