Title:
ピックオフトランスデューサワイヤボンドビット検出
Document Type and Number:
Japanese Patent JP6660295
Kind Code:
B2
Abstract:
A sensor device includes at least two transducers, a sensor signal processing circuit, and a transducer to sensor signal processing circuit electrical connections, each connecting a respective one of the transducers to the sensor signal processing circuit. The device also includes a differential amplifier connected with two bond wires, the bond wires connected to the differential inputs of the differential amplifier and the amplifier output connected to the sensor signal processing circuit.
Inventors:
Durston, Michael Terence
Sitch, Douglas Robert
Sitch, Douglas Robert
Application Number:
JP2016522634A
Publication Date:
March 11, 2020
Filing Date:
July 03, 2014
Export Citation:
Assignee:
SILICON SENSING SYSTEMS LIMITED
International Classes:
G01P21/00
Domestic Patent References:
| JP2013521486A | ||||
| JP6324071A |
Foreign References:
| WO2013079925A1 | ||||
| US20130031950 |
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Tomioka Kiyoshi