To provide a piezoelectric device which is improved in oscillation characteristics through a process of improving the electrical conduction between a mounting electrode and a piezoelectric oscillation piece, both being housed in a package, without deteriorating the piezoelectric device in shock-resistant properties, and to provide a method of manufacturing the same.

The piezoelectric device is equipped with the package 36, provided with the mount electrode 31 and the piezoelectric oscillator 32 bonded to the mount electrode 31 by a conductive adhesive agent 43. The mount electrode 31 is provided with a recess 60, where gold or a gold alloy is exposed on its surface facing toward the piezoelectric oscillator 32, and the conductive adhesive agent 43 is formed of a hard conductive adhesive agent 43a applied in the recess 60 and a soft conductive adhesive agent 43b which is arranged closer to the piezoelectric oscillator 32 than the hard conductive adhesive agent 43a.