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Title:
Piezoelectric device manufacturing method
Document Type and Number:
Japanese Patent JP6365690
Kind Code:
B2
Abstract:
A method for manufacturing a piezoelectric device that includes a substrate and a vibration portion that can include a membrane or a beam that is directly or indirectly supported by the substrate and arranged above the substrate. Moreover, the vibration portion includes a piezoelectric layer and the method includes forming the vibration portion and adjusting a resonance frequency of the vibration portion by locally subjecting a region including the vibration portion to heat treatment.

Inventors:
Takuo Haneda
Yamamoto Kansho
Application Number:
JP2016569310A
Publication Date:
August 01, 2018
Filing Date:
January 05, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L41/253; B81C1/00; H01L41/09; H01L41/113; H04R17/00; H04R31/00
Domestic Patent References:
JP2002026007A
JP2005528010A
JP2007024862A
Attorney, Agent or Firm:
Fukami patent office