Title:
圧電デバイス製造方法
Document Type and Number:
Japanese Patent JP7167657
Kind Code:
B2
Abstract:
To provide a piezoelectric device manufacturing method capable of manufacturing a piezoelectric device with a highly reliable piezoelectric element, where each width of bypass wiring and connection wiring is designed suitably.SOLUTION: A piezoelectric device manufacturing method includes a first electrode formation step of forming a first electrode placed in a first region of a diaphragm, first bypass wiring placed in a second region of the diaphragm different from the first region, and having a first slit, and first connection wiring placed across the first and second regions and connecting the first electrode and the first bypass wiring, a piezoelectric layer formation step of forming a piezoelectric layer so as to cover the first electrode, the first bypass wiring and the first connection wiring, a piezoelectric formation step of forming piezoelectric by removing a part of the piezoelectric layer, so that a portion of the piezoelectric layer overlapping the first electrode, in the plan view, remains, and a second electrode formation step for forming a second electrode on the piezoelectric.SELECTED DRAWING: Figure 6
Inventors:
Kojima force
Koji Ohashi
Koji Ohashi
Application Number:
JP2018219036A
Publication Date:
November 09, 2022
Filing Date:
November 22, 2018
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L41/29; G01S7/521; H01L41/09; H01L41/113; H01L41/332; H04R17/00; H04R31/00
Domestic Patent References:
| JP2017009567A | ||||
| JP2015066203A | ||||
| JP2016015434A |
Attorney, Agent or Firm:
Intellectual Property Office